trend izinzile elektroniki mihla ukuqinisekisa ukuba ufakelo uba ubunjwe ngakumbi. Isiphumo soku yaba ukuvela ezo housings BGA. Pike ezi mpawu ekhaya kwaye siya kuqwalaselwa phantsi kweli nqaku.
ulwazi jikelele
Ekuqaleni oku kwaku izigqibo ezininzi phantsi umzimba chip. Ngenxa yoko, ukuba zabekwa kwindawo encinane. Oku kukuvumela ukuba ugcine ixesha nokudala izixhobo nangakumbi efinyeziweyo. Kodwa ke kukho ndlela ekwenzeni ujika ngenkxamleko ngexesha lokulungiswa kwezixhobo zobuchwepheshe iphakheji BGA. Brazing kulo mzekelo, kufuneka babe echanileyo kanye eyenziwa ithekhinoloji.
Yintoni ekufuneka?
Kufuneka Stock up on:
- station ngelotha, apho kukho umpu ubushushu.
- Amashiya.
- Solder paste.
- Tape.
- Desoldering qhina.
- Flux (kukhethwa pine).
- Istensile (ukuba isicelo solder ngoku vula a chip) okanye spatula (kodwa kungcono ukuba bahlale lwalo lokuqala).
Ngelotha BGA-angaphathi ayikho into enzima. Ke ukuba ukusebenza ngempumelelo, kuyimfuneko ukuba enze ukulungiselela kwindawo yomsebenzi. Kwakhona kungenzeka ukuphindaphindwa izenzo ochazwe nqaku ukuxelelwa malunga iimpawu. Ke chips technology ngelotha kwi yempahla BGA akayi kuba nzima (ukuba ingqondo le nkqubo).
iimpawu
Ukuxelela ukuba bugcisa iiphakheji BGA solder, kufanele kuphawulwe izakhono ezipheleleyo iimeko phindo. Ngoko ke, ukuba kusetyenziswe amaphepha Chinese-eyenziwe. peculiarity wabo ukuba kukho chips eziliqela iqokelelwe intwana enye enkulu. Ngenxa oku xa istensile shushu eqalisa begoba. Ubukhulu enkulu yeqela lenjongo kukhokelela yokuba ukhetha xa ngokushushubeza isixa esikhulu ubushushu (oko kukuthi, kukho nefuthe kwiradiyetha). Ngenxa yoku, kufuneka ixesha elingakumbi ukushushubeza nj (leyo echaphazela kakubi intsebenzo yayo). Kwakhona, loo kokuwanika ziveliswa ngasekhohlo imichiza. Ngoko ke, le ntlama isicelo akukho lula njengoko iisampula ezenziwe laser ahlabayo. Kaloku, ukuba uya khona thermojunction. Oku kuya kuthintela besibekeka amaphepha ngexesha ukufudumeza zabo. Kwaye ekugqibeleni kufuneka kuqatshelwe ukuba iimveliso ezenziwe ukusebenzisa laser ukusika, inika ukuchaneka ophezulu (ecaleni awudluli microns 5). Kwaye ngenxa yoku kunokuba lula futhi ukusebenzisa design ezinye iinjongo. Kule umbusi lugqityiwe, kwaye iya kuphonononga oko kuza ngelotha BGA package neteknoloji ekhaya.
uqeqesho
Phambi kokuqala otpaivat chip, kuyimfuneko ukubeka bemchukumisa bagqibezela ngomhla ngohlangothi yomzimba wakhe. Oku kufuneka kwenziwe kwi engekho yokushicilela screen, obubonisa component position-elektroniki. Oku kufuneka kwenziwe yokulungelelanisa ukwenziwa kwe-chip emva ebhodini. Dryer mazizenzele umoya ufudumale kwi degrees 320-350 Celsius. Kule meko Velocity umoya kufuneka ibe ncinci (ngenye iza kutshintsha umva solder akulahle ezikufutshane). Dryer kufuneka igcinwe ukuze ukuba aa Incopho ebhodini. Preheat le ndlela malunga okomzuzu. Ngaphezu koko, umoya kufuneka zithunyelwe embindini kunye iperimitha (ngohlangothi) yebhodi. Oku kuyimfuneko ukuze uphephe nobushushu, ngathi ngembonakalo yikristale. A ethe-ethe kakhulu kule memory. Kulandelwe igwegwe kwenye ekupheleni chip, abuye avuke ngaphezu kwibhodi. Ubani kufuneka sizame singanichithi okusemandleni am. Ngapha koko, ukuba solder zange zanyibilika ngokupheleleyo, ngoko kukho umngcipheko ukukrazula umkhondo. Maxa wambi xa isicelo ekubhobhozeni kunye solder ukufudumala uqalisa ukuba zifunjwe iibhola. isayizi yazo iya kuba kolwabelo olungalinganiyo. Kwaye chips ngelotha kwi yempahla BGA wangenwa yintaka.
nokucoca
Faka spirtokanifol, shushu ngayo aze inkunkuma eziqokelelweyo. Kulo mzekelo, qaphela ukuba indlela efanayo ayikwazi kuyo nayiphi na imeko ingasetyenziswa xa usebenza ngelotha. Oku kungenxa inomlingani ethile esezantsi. Ilandelwa yi lokucoca kwindawo yokusebenza, kwaye kuya kuba yindawo elungileyo. Emva koko, ahlole imeko ngeziphumo zophando ukuze bahlole ukuba kunokwenzeka ukufaka kubo kwindawo endala. Ekubeni impendulo nezingalunganga ukuba itshintshwe. Ngoko kuyimfuneko ukuba eli qumrhu kunye neetships le solder endala. Kukho kwakhona kungenzeka ukuba uya kunqunyulwa "penny" ebhodini (usebenzisa i qhina). Kulo mzekelo, kwakunye kunokumnceda ngelotha yentsimbi elula. Nangona abanye abantu basebenzisa ne qhina noboya yokomisa. Xa zazo enza kufuneka esweni ingqibelelo imaski solder. Ukuba yonakele, ngoko ke rastechotsya solder ecaleni kweendlela, buzimisile. Kwaye ngoko BGA-ngelotha akuyi kuphumelela.
iibhola ezintsha Knurled
Ungasebenzisa okusilelayo sele zilungisiwe. Ba kwimeko enjalo, kufuneka nje ukuba angene phakathi kwamagqabi inyibilike. Kodwa le efanelekileyo kuphela inani elincinane kwizigqibo (ngaba unokuyithelekelela chip ne 250 "iinyawo"?). Ngoko ke, njengokuba enye indlela elula ukuhluza iteknoloji isetyenziswa. Ngenxa lo msebenzi wenziwe ngokukhawuleza kwaye ngumgangatho elifanayo. Kubalulekile apha ukusetyenziswa ezikumgangatho ophezulu solder paste. Ngoko nangoko uya kuguqulwa ube okuqaqambileyo ibhola egudileyo. ikopi Low-umgangatho ofanayo ziya kuzahlula ibe inani elikhulu ngeenxa "iziqwenga" encinane. Kwaye kulo mzekelo, nditsho into yokuba iqina ku degrees 400 ubushushu ukuxubana wampompoza kunokunceda. Kuba lula chip busisigxina kwi istensile. Emva koko, usebenzisa i spatula ukusebenzisa solder paste (nangona ungasebenzisa umnwe wakho). Emva koko, lo gama kugcinwe amashiya istensile, kuyimfuneko bayinyibilikisa ntlama. lobushushu wokomisa akufuneki ngaphezu 300 degrees Celsius. Kulo mzekelo icebo kufuneka nkqo kwi Cola. Le istensile kufanele ukuba zigcinwe de solder lukhuni ngokupheleleyo. Emva koko uyakwazi ukususa i tape ngesibopheleli kunye isomisi ubushushu, umoya leyo osuke ukuba degrees 150 Celsius, ngobunono ebilandelwa de uqala ukunyibilika ukubhobhoza. Unako ke Ukuqhawula chip istensile. Isiphelo japan ziya kufumaneka iibhola kakuhle. Nj kwakhona ukulungele ngokupheleleyo ukuyifaka kwi ebhodini. Njengoko ubona, ngelotha BGA-iqokobhe azikho nzima kwaye ekhaya.
izinto zokubopha
Ngaphambili, kuphakanyiswe ukwenza ugqibezela. Ukuba eli cebiso, ayizange yokubekwa kuthathelwa ingqalelo kufuneka lwenziwe ngolu hlobo lulandelayo:
- Flip chip ukuze ukuba phezulu izigqibo.
- Qhoboshela dimes elunxwemeni ukuze ungqamane ngeebhola.
- Thina ukulungisa, ekufuneka ibe buthelezi chip (kuba oku imikrwelo ezincinane ngenaliti singasebenza).
- Iqinisekile, kuqala enye indlela emva koko nkqo kulo. Ngaloo ndlela, uya kuba ngokwaneleyo imikrwelo ezimbini.
- Sibeka sinochuku izihlonipho kunye zama ukubamba iibhola ukuchukumisa pyataks kwi ukuphakama eliphezulu.
- Kuyimfuneko ukushushubeza indawo yomsebenzi de solder sikwimo otyhidiweyo. Ukuba amanyathelo ngentla zenziwa kanye chip kufuneka akuzukuba yingxaki esihlalweni sakhe. Oku kuya kunceda bayo ukugogeka ngaphezulu, eye solder. Kuyimfuneko ukuba kancinane ngobhobhozo.
isiphelo
Apha ke yonke loo nto ebizwa ngokuba 'ubugcisa chips ngelotha kwi yempahla BGA. " Kufuneka kuqatshelwe apha esisebenza akazazi kwinkoliso amateurs radio ngelotha isinyithi kunye isomisi seenwele. Kodwa ke, nangona oku, i-BGA-ngelotha ibonisa emihle. Ngoko ke, ukuba uyaqhubeka axhamle siwenze ngempumelelo kakhulu. Nangona entsha soloko kukoyika abaninzi, kodwa amava obu bugcisa buya sixhobo nezolo.